Multi-chip card

ABSTRACT

A multi-chip card comprises a plurality of sub-cards, each sub-card including an integrated circuit chip. Each chip comprises electrical contacts, and each of the subcards may be moved to occupy an active position of the card.

TECHNICAL FIELD

The present invention relates to cards comprising embedded integratedcircuits, for example bank credit and debit cards. More particularly, itrelates to such cards containing a plurality of integrated circuits.

RELATED ART

It is well known to provide an electronic identification card comprisingan embedded integrated circuit (known as a chip) containing digitallyencoded information. This is colloquially known as a chip card or smartcard. Most commonly, this will be of the contact variety in which flatconductive contacts on one face of the card provide an electronicinterface to the integrated circuit. Many hundreds of millions of suchcards are in use worldwide. The major use for these cards is as creditor debit cards issued to account holders by banks and other financialinstitutions. Other uses include personal identification cards, healthentitlement cards, store loyalty cards, stored value cards (electronicpurses), information storage cards, and the like. The majority of chipcards conform to international standard ISO/IEC 7816 which specifiesaspects of the card such as the positioning of the integrated circuitand contacts, the layout of the contacts, and their functions. Themajority are the same size as the previous generation of credit anddebit cards and the like in which information is encoded solely on amagnetic stripe. These cards are covered by international standardISO/IEC 7810, ID-1 format, which specifies dimensions of 85.60 mm(85.60×10⁻³ m) long by 53.98 mm (53.98×10⁻³ m) wide. In addition,international standard ISO/IEC 7813 further specifies the thickness as0.76 mm (0.76×10⁻³ m).

As the use of chip cards increases, so also does the number of cardswhich a user must carry. Various solutions have been proposed to allow asingle card to perform multiple functions.

United States patent no. U.S. Pat. No. 4,700,055 discloses a systemwhich enables a user to carry one credit card instead of many. Theinformation pertaining to each credit card account, such as the name ofthe account, the number of the account, and its expiration date, areencoded on the card, by magnetic means, with a semiconductor memorydevice, or using any other means of recording data. The invention alsoincludes a microprocessor-based system which accepts the card,determines whether the credit card account selected for use by the ownerof the card is valid, and prints a credit card invoice. The single cardcan thus be used in place of a large number of different credit cards.

United States patent no. U.S. Pat. No. 5,912,453 discloses integrationof multiple application programs on one chip card, whereby theapplication programs stored on it do not have access to each other,which is achieved through a separation and decoupling of the individualprograms from one another.

United States patent no. U.S. Pat. No. 7,191,952 discloses a selectablemulti-purpose card comprising a plurality of features stored in a memorystorage device operatively mounted on the card. The plurality offeatures allows the card to function as multiple cards, and a selectiondevice mounted on the card enables a user to select any of the pluralityof card features in a single step.

France patent no. FR 2627880 discloses a smart card comprising severalintegrated circuit chips placed with their contacts for access tolocations corresponding to a normalized position of the card. Eachintegrated circuit corresponds to a clearly defined function of the cardand the choice of the function to be implemented is determined by thedirection of orientation of the card when introduced into a card reader.

WIPO International published patent application no. WO 98/14916 alsodiscloses a smart card comprising up to four integrated circuit chipsplaced with their contacts for access by a card reader depending on theorientation of the card.

SUMMARY OF THE INVENTION

It would be advantageous to provide a card having multiple functions onone card but not requiring any modifications to the reading system. Itwould also be advantageous to provide a card having multiple functions,these being selectable by the user, and allowing more than four separateintegrated circuits on a single card. It would further also beadvantageous to allow flexibility as to which integrated circuits aremounted on a single card.

Accordingly, viewed from a first aspect the present invention provides amulti-chip card comprising a plurality of sub-cards. At least one of theplurality of subcards comprises an integrated circuit chip, and theintegrated circuit chip comprises electrical contacts. At least one ofthe plurality of sub-cards is operable for moving to occupy an activeposition of the card.

The present invention provides a multi-chip card operable for insertinginto a chip card reader. The electrical contacts of the integratedcircuit chip at the active position are operable for communicating withthe reader by electrical contacts in the reader.

The present invention provides a multi-chip card further comprising acard body. The card body comprises a plurality of edges along theperiphery of the card, and a cutaway portion suitably spaced from one ofthe plurality of edges of the card body. The cutaway portion comprises aplurality of edges suitably arranged substantially parallel to or atright angles to the one of the plurality of card body edges, and thecutaway portion extends at least part way through the thickness of thecard body.

The present invention provides a multi-chip card in which a sub-cardcomprises a front face comprising electrical contacts. The sub-cardfurther comprises edges which are operable for being slideablyengageable with an edge of the card cutaway portion and an edge of anadjacent sub-card.

The present invention provides a multi-chip card in which sub-cards areslideably engageable by respective complementing protruding and recessededge profiles of sub-cards and the card cutaway portion.

The present invention provides a multi-chip card in which the slideableengagement is by a tongue and groove mechanism.

The present invention provides a multi-chip card in which the card bodycomprises a section extending between the cutaway portion and a cardbody edge, the section operable for removing, so that a sub-card may beremoved or added.

Viewed from a second aspect, the invention provides a method ofmanufacturing a multi-chip card. The method comprises providing a cardbody which comprises a plurality of edges along the periphery of thecard, and a cutaway portion suitably spaced from one of the plurality ofedges of the card body. The cutaway portion comprises a plurality ofedges suitably arranged parallel to or at right angles to the one of theplurality of card body edges, and the cutaway portion extends at leastpart way through the thickness of the card body. A plurality ofsub-cards is also provided. At least one of the plurality of sub-cardscomprises an integrated circuit chip, the integrated circuit chipcomprising electrical contacts, and further comprises edges which areoperable for being slideably engageable with an edge of the card cutawayportion and an edge of an adjacent sub-card. A plurality of sub-cards isinserted into the cutaway portion

The present invention provides a method of manufacturing a multi-chipcard which further comprises providing a card body comprising a sectionextending between the cutaway portion and a card body edge. The sectionis operable for removing, so that a sub-card may be removed or added.

The present invention provides a method of manufacturing a multi-chipcard comprising one or more of the processes of cutting, stamping,laminating, or moulding.

Viewed from a third aspect, the invention provides a method of using amulti-chip card, comprising providing a plurality of sub-cards. At leastone of the plurality of sub-cards comprises an integrated circuit chip,and the integrated circuit chip comprises electrical contacts, and theat least one of the plurality of sub-cards is operable for moving tooccupy an active position of the card. The card is inserted into a chipcard reader so that the electrical contacts of the integrated circuitchip at the active position are operable for communicating with thereader by electrical contacts in the reader. The integrated circuit chipat the active position may then be addressed by the card reader.

The present invention provides a method of using a multi-chip card inwhich the at least one of the plurality of sub-cards comprises adiscrete function relative to a second of the plurality of sub-cards.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will now be described in detail by way ofexample only with reference to the following drawings.

FIG. 1 a illustrates an arrangement of a smart card comprising a singleembedded integrated circuit, according to the prior art.

FIG. 1 b illustrates an arrangement of a smart card comprising multipleintegrated circuits, as disclosed in the prior art.

FIG. 2 a illustrates a plan view of the front face of a multi-chip cardaccording to embodiments of the present invention.

FIG. 2 b illustrates the constituent parts of a multi-chip card, a cardframe with a cutaway central section and a single sub-card suitable foruse therein, according to embodiments of the present invention.

FIGS. 2 c to 2 f illustrate operation of a multi-chip card according toembodiments of the present invention.

FIG. 3 a illustrates a plan view of the electrical contact bearing faceof an individual integrated circuit containing sub-card, according toembodiments of the present invention.

FIG. 3 b illustrates a perspective view of an individual integratedcircuit containing sub-card, showing the electrical contact bearing faceaccording to embodiments of the present invention.

FIG. 3 c illustrates a cross-sectional view of an individual integratedcircuit containing sub-card, as viewed from its edge or shortestdimension, taken along the section B-B shown in FIG. 3 a, according toembodiments of the present invention.

FIG. 4 a illustrates a cross-sectional view of a multi-chip cardaccording to embodiments of the present invention, as viewed from itsedge or shortest dimension, taken along the section A-A shown in FIG. 2a.

FIG. 4 b illustrates a cross-sectional view of a multi-chip cardaccording to additional embodiments of the present invention, as viewedfrom its edge or shortest dimension, taken along the section A-A shownin FIG. 2 a.

FIG. 5 a illustrates a perspective view of an individual integratedcircuit containing sub-card, showing the electrical contact bearing faceaccording to additional embodiments of the present invention.

FIG. 5 b illustrates a cross-sectional view of an individual integratedcircuit containing sub-card, as viewed from its edge or shortestdimension, taken along the section B-B shown in FIG. 3 a, according toadditional embodiments of the present invention.

FIG. 5 c illustrates a cross-sectional view of a multi-chip cardaccording to additional embodiments of the present invention, as viewedfrom its edge or shortest dimension, taken along the section A-A shownin FIG. 2 a.

FIGS. 6 a to 6 d illustrate the replacement of an individual integratedcircuit containing sub-card by a different integrated circuit containingsub-card, according to further embodiments of the present invention.

FIG. 7 illustrates further embodiments of the present invention in whichthe central cutaway section is not rectangular in shape, but ratherL-shaped as viewed from the front face of the multi-chip card of thepresent invention.

DETAILED DESCRIPTION

FIG. 1 a illustrates a chip card as well known in the prior art. Theterm chip card is used herein for cards comprising integrated circuits.The terms smart card and integrated circuit card are among other termsthat have also been used in the prior art. Card body 110 is of standarddimensions, for example as specified by ISO/IEC standards. Card body 110is formed of a suitable material, usually a plastic material such aspolyvinyl chloride (PVC), although other materials such as paper-basedsubstrates may be used. The term front face is used herein to describe amajor face of the card comprising electrical contacts. On the front facethe card are electrical contacts 120 of an electrically conductive metalsuch as gold or aluminium. The contacts 120 provide an interface to anembedded integrated circuit (or chip) within the card body. The positionof the contacts 120 is specified by ISO/IEC standards. When the card isinserted into a card reader (not shown) further electrical contacts inthe card reader mechanism make electrical contact with the contacts 120on the card to provide addressable access to the information stored inthe card chip.

FIG. 1 b illustrates a multi-chip card according to prior art asdisclosed by France patent no. FR 2627880 and International publishedapplication no. WO 98/14916. In this prior art, a single chip card maycontain up to four integrated circuits and associated contacts. Thecontacts are positioned so as to provide access to a differentintegrated circuit depending on how the card is orientated. Card 130 hascontacts 140 a and 140 b on the front face of the card, diagonallyopposite each other. Contacts 140 a are presented to a card reader whenthe card is inserted orientated in a conventional manner. Rotating thecard through 180 degrees presents contacts 140 b to the reader. Turningthe card over reveals two contacts 140 c and 140 d on the reverse of thecard. These may be inserted into a card reader in a manner similar tothose on the front face.

FIG. 2 a shows a multi-chip chip card 200 as viewed from the front faceof the card according to embodiments of the present invention. Card body210 of card 200 has dimensions in accordance with those of known chipcards, for example in accordance with ISO/IEC standards for ISO/IEC7810, ID-1 format. The two major edge dimensions of the card willhereinafter be termed length for the longer and width for the shorter,and the third much smaller edge dimension will be termed thickness andwill hereinafter be referred to as the card edge. Electrical contacts240 a are in the same position relative to card body 210 as are contacts120 on known chip card 110 of the prior art of FIG. 1 a. This positionwill hereinafter be termed the active position of the card. Insertion ofthe multi-chip card 200 as illustrated in FIG. 2 a into a card readerwill cause card reader contacts to make contact with contacts 240 a andso enable the card reader to address the contents of the integratedcircuit associated with contacts 240 a at this active position.

Multi-chip card 200 comprises card body 210 which, viewed from the frontface, comprises a cutaway portion 220 spaced from each length and widthedge of card body 210 and surrounded by the card body 210. Asillustrated in FIG. 2 a, cutaway portion 220 is rectangular in shapewith length and width edges parallel with, respectively, length andwidth edges of card body 210. In embodiments, cutaway portion 220comprises the full thickness of card body 210. Card 200 comprises inaddition a plurality of individual smaller cards, or sub-cards, 230 a to230 g. Sub-cards 230 a to 230 g are substantially identical to eachother and rectangular in shape as viewed from the front face of card200. Each sub-card 230 a to 230 g comprises an embedded integratedcircuit chip comprising contacts on at least the face visible whenviewed from the front face of card 200. A generic sub-card 230 isillustrated in FIG. 2 b comprising electrical contacts 240. In FIG. 2 a,sub-card 230 a comprises contacts 240 a in the active position to beread by a card reader on insertion therein of card 200.

As depicted in FIG. 2 a, each sub-card 230 a to 230 g is independentlymoveable with respect to each other and to card body 210. Each sub-card230 a to 230 g is in a slideably engageable relationship with adjacentsub-cards and with the edges of cutaway portion 220 of card body 210.Each sub-card 230 a to 230 g is therefore retained securely withincutaway portion 220. Each sub-card 230 a to 230 g is operable formovement within cutaway portion 220 along two axes of movement parallelto respectively length and width of card 200. Cutaway portion 220 is oflength and width dimensions corresponding to an integer multiple of,respectively, the length and width of each sub-card 230 a to 230 g. Itwill be apparent that in embodiments the number of sub-cards which maybe accommodated within cutaway portion 220 of card body 210 is theproduct of multiplying the sub-card width multiple (y) by the sub-cardlength multiple (x), minus one (xy−1) to leave a space to allowsub-cards to be moved around. As shown in FIG. 2 a, cutaway portion 220is two sub-card widths by four sub-card lengths in size. The number ofsub-cards of generic form 230, for example sub-cards 230 a to 230 g,which may be accommodated within cutaway portion 220 and allow movementof individual sub-cards is therefore xy−1, or (2×4)−1, i.e. seven (7)sub-cards. In FIG. 2 a therefore, seven (7) sub-cards 230 a to 230 g areindividually moveable. From the position illustrated in FIG. 2 a,sub-cards 230 d and 230 g are adjacent to space 250. Either sub-card 230d or sub-card 230 g may be moved to occupy space 250.

FIG. 2 b illustrates the engaging arrangement according to embodimentsof the present invention. As shown, a slideable engagement may beprovided using a tongue and groove arrangement. When viewed from thefront face of card 200, each sub-card 230 comprises a tongue arrangement260 a on two adjacent edges and a groove arrangement 260 b on theopposite two adjacent edges. In the illustrated embodiment, tongue 260 ais along top and left edges of sub-card 230 and groove 260 b is alongright and bottom edges of sub-card 230. Cutaway portion 220 of card body210 comprises groove arrangement 270 a corresponding to tongue 260 aalong two adjacent edges of cutaway portion 220, and tongue arrangement270 b corresponding to groove 260 b on the opposite two adjacent edgesof cutaway portion 220. In operation of card 200 therefore, tongues 260a of each sub-card 230 may mateably engage corresponding groove 270 a ofcard body 210, or groove 260 b of an adjacent sub-card.

FIG. 2 a and FIGS. 2 c to 2 f illustrate the operation of embodiments ofthe present invention. In FIG. 2 a, sub-card 230 a is in the activeposition in which contacts 240 a are read when card 200 is inserted intoa card reader. Four sub-cards 230 a to 230 d occupy the top row ofsub-cards in cutaway portion 220 of card body 210. The lower row ofsub-cards is occupied by sub-cards 230 e to 230 g and space 250. Thisarrangement means that it is impossible for sub-cards on the top row tomove in the length direction when the card is inserted into a reader.Likewise, sub-card 230 e is directly below sub-card 230 a and preventsmovement of sub-card 230 a in the width direction. Contacts 240 a ofsub-card 230 a are therefore securely located in the active contactposition.

Assume that a user of card 200 now desires to access the functionsembodied by the integrated circuit chip of sub-card 230 b. The user musttherefore move sub-cards 230 a to 230 g so as to position sub-card 230 bin the active position. In FIG. 2 c, the user moves sub-cards 230 e to230 g to the right so that 230 g occupies the space 250, so that space250 is now below sub-card 230 a. In FIG. 2 d, the user moves sub-card230 a down into space 250, which is now in the active position. In FIG.2 e, the user moves sub-cards 230 b to 230 d to the left into space 250,so that space 250 is now at the right end of the top row. Sub-card 230 bis now in the active position so that electrical contacts 240 b may nowbe read when sub-card 200 is inserted into a card reader, and thefunctions of the integrated circuit of sub-card 230 b accessed. Lastly,in FIG. 2 f, the user moves sub-card 230 g into space 250 on the toprow, so that space 250 now occupies the bottom right space. The top rowis full of sub-cards, and in this way, sub-card 230 b is prevented frommoving when card 200 is inserted into a card reader.

FIGS. 3 a to 3 c illustrate in more detail the construction of anindividual sub-card 230 according to embodiments of the presentinvention. FIG. 3 a is a plan view of a sub-card 230 viewed from its topmajor face. Sub-card 230 comprises an embedded integrated circuit chipcomprising electrical contacts 240. Contacts 240 are faced with anelectrically conductive material such as an electrically conductivemetal such as gold. Sub-card 230 comprises a protruding member such astongue 260 a along two adjacent edges of the sub-card. The opposite twoedges comprise a recessed member such as groove 260 b suitable formateable and slideable engagement with a tongue of similarcross-sectional profile to tongue 260 a.

FIG. 3 b illustrates a perspective view of a sub-card 230 according toembodiments of the present invention. An embedded integrated circuitchip has electrical contacts 240 on the front major face of thesub-card. In FIG. 3 b, tongue 260 a is arranged so that its centre inthe thickness direction is substantially coincident with the centre ofthickness of sub-card 230. Groove 260 b is similarly shaped so as to besuitable for mateable and slideable engagement with an adjacent sub-cardtongue 260 a. Tongues 260 a and grooves 260 b are similarly suitable forslideable engagement with groove 270 a and tongue 270 b of cutawayportion 220 of card body 210 (see FIG. 2 b).

FIG. 3 c illustrates a cross section of sub-card 230 according toembodiments of the present invention, taken for example along the lineB-B in FIG. 3 a. Sub-card 230 has electrical contacts 240 on its top, orfront major face. Contacts 240 connect to integrated circuit chip 310embedded in sub-card 230. Sub-card 230 has tongues 260 a andcorresponding grooves 260 b.

FIG. 4 a illustrates a cross section 400 taken through a multi-chip cardaccording to embodiments of the present invention, for example along theline A-A of card 200 of FIG. 2 a. In FIG. 4 a, card body 410 has cutawayportion 415 corresponding to cutaway portion 220 of FIG. 2 a. Cutawayportion 415 is occupied by sub-cards 420 a and 420 b, correspondingrespectively to sub-cards 230 b and 230 f of FIG. 2 a. In embodiments,each of sub-cards 420 a and 420 b comprises for example a sub-card asdescribed with reference to FIGS. 3 a to 3 c above. Card body 410comprises cutaway portion 415 occupied by sub-cards 420 a and 420 b.Tongue of sub-card 420 a mates slideably with groove of card body 410 at450 a. Tongue of sub-card 420 b mates slideably with groove of sub-card420 a at 450 b. Tongue of card body 410 mates with groove of sub-card420 b at 450 c.

FIG. 4 b illustrates a further embodiment of the present invention. Inthis further embodiment, cross section 425 is also taken through aposition corresponding to line A-A illustrated on FIG. 2 a. In thisembodiment, however, card body 430 comprises cutaway portion 435 whichdoes not extend through the whole thickness of card body 430. In thisembodiment, therefore, card body 430 extends over the whole of thebottom surface of cutaway portion 435, thereby covering the whole areaindicated by 225 on FIG. 2 b. Sub-cards in this embodiment, for example440 a and 440 b, must therefore be thinner than sub-cards in previouslydescribed embodiments. Tongue of sub-card 440 a mates slideably withgroove of card body 430 at 460 a. Tongue of sub-card 440 b matesslideably with groove of sub-card 440 a at 460 b. Tongue of card body430 mates with groove of sub-card 440 b at 460 c.

One potential advantage of the arrangement of this embodiment is thatsub-cards are supported over the whole of their back surfaces (thereverse of the major faces comprising electrical contacts).

Another embodiment of the present invention is illustrated in FIGS. 5 ato 5 c. In this embodiment, the slideably engageable arrangement extendsflush with the bottom surface of each sub-card. In FIG. 5 a, aperspective view of sub-card 510 comprises electrical contacts 520 ontop major face of sub-card 510. Extension 530 a and indented portion 530b perform the function of tongue and groove slideable mating of thepreviously described embodiments. FIG. 5 b illustrates a cross sectioncorresponding to line B-B on FIG. 3 a.

Integrated circuit chip 540 of sub-card 510 has contacts 520 on its topmajor face. FIG. 5 c is a cross section 500 through a multi chip cardaccording to this embodiment, and corresponds to the line A-A in FIG. 2a. In FIG. 5 c, card body 550 extends over the whole of the bottom ofcutaway portion 525. This is similar to the embodiment illustrated inFIG. 4 b.

Yet another embodiment of the present invention is illustrated in FIGS.6 a to 6 d. In this embodiment, the multi-chip card 600 in FIG. 6 a isprovided with a facility to change the sub-cards loaded in cutawayportion 620 of card body 610. In other respects, card 600 functions asdescribed for multi-chip cards of one or another of the previouslydescribed embodiments. In FIG. 6A, a user of card 600 desires tointroduce a new sub-card 630 x into the collection of sub-cards inmulti-chip card 600. Card body 610 of card 600 comprises removablesection 660 which may have substantially the same thickness dimension aseach individual sub-card 630 a to 630 g and 630 x. Removable section 660also comprises a slideable mating arrangement as provided for individualsub-cards such as a tongue and groove arrangement as described withreference to previously described embodiments.

Removable section 660 is removed by sliding out in the direction asshown in FIG. 6 a. A single sub-card 630 g is also then removed bysliding through the channel left by the removal of section 660. FIG. 6 billustrates the insertion of replacement sub-card 630 x by sliding alongthe channel into cutaway portion 620. In FIG. 6 c, removable section 660is replaced by sliding into the channel to retain the insertedsub-cards. FIG. 6 d illustrates a cross section of card body 610 of card600 taken along the line C-C shown in FIG. 6 c. Removable section 660has tongue at 665 a mating with groove of channel in card body 610.Likewise removable section 660 has groove at 665 b mating with tongue ofcard body 610 channel. It will be apparent that although a tongue andgroove arrangement covering the whole thickness of card body 610 hasbeen described with reference to this embodiment as illustrated forexample in FIG. 4 a, any other suitable slideable mating engagement maybe used, for example as described with reference to embodiments asillustrated in FIG. 4 b or in FIG. 5 c. It will also be apparent thatwith the currently described embodiment there is no requirement to leavea space 650 in cutaway section 620 to allow sub-cards 630 to be moved.This is because removable section 660 may be removed followed by theremoval of a convenient sub-card to create a space 650 for sub-cardmovement as required.

FIG. 7 illustrates yet another exemplary embodiment of the presentinvention. In this embodiment, multi-chip card 700 has card body 710comprising cutaway section 720 which is L-shaped as viewed from the topmajor face of the card 700. Sub-cards 730 a to 730 f are provided incutaway section 720 with space 750 allowing sub-cards to be moved as inpreviously described embodiments. As illustrated, sub-card 730 a is inthe active position so that electrical contacts 740 a of sub-card 730 amay be contacted when card 700 is inserted into a card reader to allowthe contents of the integrated circuit of sub-card 730 a to beaddressed.

In further embodiments, one or more sub-cards may comprise aconstruction different from that described for sub-card 230 illustratedin FIGS. 3 a to 3 c. For example, in an embodiment, one or more of thesub-cards may comprises a non-contact integrated circuit chip addressedby means of, for example, short range wireless technology. In anotherembodiment, one or more of the sub-cards may comprise a dummy, or blank,sub-card which does not comprise an integrated circuit chip. The blanksub-card is provided to make up the number of sub-cards where the numberof sub-cards comprising integrated circuit chips is lower than thatrequired to occupy the card body cutaway portion in the embodimentspreviously described.

In further embodiments of the present invention, methods ofmanufacturing multi-chip cards of the previously described embodimentsare provided. With reference to the embodiment illustrated in FIG. 2 a,smart card body 210 of smart card 200 may be manufactured separatelyfrom each of the sub-cards 230 a to 230 g. Card body 210 may be formedin a similar manner as is known in the art for the manufacture ofcurrently available chip cards. In an embodiment, a substrate, forexample a polyvinyl chloride or similar plastic sheet, is stamped or cutor otherwise formed from a sheet of the material. It is then coveredwith a layer front and back with the printed indicia required for thecard description, followed by a layer of transparent overlay, and thewhole assembly laminated using any suitable lamination technique asknown in the prior art. In a further embodiment, card body 210 may beformed by moulding, for example by injection moulding. In this case,card body 210 may be formed from an acrylonitrile butadiene styrene(ABS) plastic. In a further embodiment, card body 210 may be formed froma paper-based substrate, or other biodegradable material, for example bystamping or cutting from a sheet of the substrate material. In eachcase, the cutaway section edge profile 270 a, 270 b, may be formed byany suitable technique, for example by cutting or during the mouldingprocess, as appropriate.

In a further embodiment, a sub-card, such as sub-card 230, may bemanufactured by a technique similar to that used for the formation ofknown chip cards. The integrated circuit chip and its contacts may bemanufactured using any of the techniques as known in the prior art formanufacturing known chip cards of the contact type. It is typically thenembedded in a suitable material, such as an epoxy resin, to form apackage. As for card body 210, the body of the sub-card 230 may bemanufactured in a manner similar to the method for making a conventionalchip card body, as known in the art. The chip package is attached in ashaped recess in a sub-card body by gluing or other suitable attachmentmethod. In like manner as for card body manufacture, the edge profile260 a, 260 b, of the sub-card 230 may be formed by any suitabletechnique, for example by cutting or during moulding, as appropriate.

It will be understand that the above description covers a number ofembodiments which are described by way of example only, and are notintended to be limiting. It will be understood that other constructions,methods of use and methods of manufacture may be envisaged withoutdeparting from the scope of the invention as described in the attachedclaims.

1. A multi-chip card, comprising: a plurality of sub-cards, at least oneof the plurality of sub-cards comprising an integrated circuit chip, theintegrated circuit chip comprising electrical contacts; and the at leastone of the plurality of sub-cards configured for moving to occupy anactive position of the card.
 2. The multi-chip card of claim 1, whereinthe multi-chip card is configured for insertion into a chip card reader,and wherein the electrical contacts of the integrated circuit chip atthe active position are configured for communicating with the reader byelectrical contacts in the reader.
 3. The multi-chip card of claim 1,wherein the multi-chip card further comprises: a card body, comprising:a plurality of edges along a periphery of the card; and a cutawayportion spaced from one of the plurality of edges of the card body,wherein the cutaway portion comprises a plurality of edges arrangedsubstantially parallel to or at right angles to the one of the pluralityof card body edges, and wherein the cutaway portion extends at leastpart way through a thickness of the card body.
 4. The multi-chip card ofclaim 3, wherein the at least one of the plurality of sub-cardscomprises a front face comprising electrical contacts, and wherein theat least one of the plurality of sub-cards further comprises edges whichare configured for slideable engagement with an edge of the card cutawayportion and an edge of an adjacent sub-card.
 5. The multi-chip card ofclaim 4, wherein the sub-cards are slideably engageable by respectivecomplementing protruding and recessed edge profiles of sub-cards and thecard cutaway portion.
 6. The multi-chip card of claim 5, wherein theslideable engagement is by a tongue and groove mechanism.
 7. Themulti-chip card of claim 3, wherein the card body comprises a sectionextending between the cutaway portion and a card body edge, the sectionconfigured for removal from the card body to allow a sub-card to beremoved from or added to the card body.
 8. A method of manufacturing amulti-chip card, comprising: providing a card body, the card bodycomprising: a plurality of edges along a periphery of the card; and acutaway portion spaced from one of the plurality of edges of the cardbody, wherein the cutaway portion comprises a plurality of edgesarranged parallel to or at right angles to the one of the plurality ofcard body edges, and wherein the cutaway portion extends at least partway through a thickness of the card body; providing adjacent the cardbody: a plurality of sub-cards, at least one of the plurality ofsub-cards comprising an integrated circuit chip, the integrated circuitchip comprising electrical contacts, and the at least one of theplurality of sub-cards further comprising edges which are configured forslideable engagement with an edge of the card cutaway portion and anedge of an adjacent sub-card; and inserting a plurality of sub-cardsinto the cutaway portion.
 9. The method of manufacturing a multi-chipcard of claim 8, wherein the card body comprises a section extendingbetween the cutaway portion and a card body edge, the section configuredfor removal from the card body to allow a sub-card to be removed from oradded to the card body.
 10. A method of using a multi-chip card,comprising: providing a plurality of sub-cards, at least one of theplurality of sub-cards comprising an integrated circuit chip, theintegrated circuit chip comprising electrical contacts; the at least oneof the plurality of sub-cards being configured for moving to occupy anactive position of the card; inserting the card into a chip card readersuch that the electrical contacts of the integrated circuit chip at theactive position are configured for communicating with the reader byelectrical contacts in the reader; and addressing the integrated circuitchip at the active position by the card reader.
 11. The method of usinga multi-chip card of claim 11, wherein the at least one of the pluralityof sub-cards comprises a discrete function relative to a second of theplurality of sub-cards.
 12. The method of using a multi-chip card ofclaim 11, further comprising: moving the at least one of the pluralityof sub-cards from the active position of the card; and moving anotherone of the at least one of the plurality of sub-cards to occupy theactive position of the card.
 13. The method of using a multi-chip cardof claim 12, further comprising slideably moving the sub-cards relativeto one another.